Power Supply in Package and Power Supply on Chip Market Demand and Forecast to 2027

The global power supply in package (PSiP) and power supply on chip (PwrSoC) market is expected to reach a valuation exceeding USD 2,300 million by 2023, as per the analysis of MRFR.


The impending need for energy conservation has expedited the need for microprocessors which can handle large power loads. Power supply in package chip (PSiP) and power supply on chip (PwrSoC) are recent power conversion technologies which can pave the path for future power management platforms. The global Power Supply in Package and Power Supply on Chip Market report by Market Research Future (MRFR) considers the various drivers and hurdles for the industry for the period of 2017 to 2023 (forecast period). The sudden outbreak of the COVID-19 virus and its impact are analyzed in the report.

Market Scope

The global power supply in package (PSiP) and power supply on chip (PwrSoC) market is expected to reach a valuation exceeding USD 2,300 million by 2023, as per the analysis of MRFR. The consumption of high-powered consumer electronic devices is expected to drive the market demand during the forecast period. Technologies advances in packaging of dies as well as customized solutions for energy conservation can bode well for the market.

The low output voltage of these processors while following the trend of miniaturization can culminate in a huge market demand. The integration of off-the-shelf converters which lower development and design costs can bolster the market demand. However, thermal challenges can impede the market growth.

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Competitive Outlook

Amkor Technology, Texas Instruments Incorporated, Bel Fuse Inc., Panasonic Corporation, ON Semiconductor, TDK Corporation, Intel Corporation, Vicor Corporation, ASE Group, and Jiangsu Changjiang Electronics Technology Co. Ltd. are key players of the global PSiP and PWoC market.


In 2017, the PSiP segment commanded for more than 89% share of the market in terms of value. It is anticipated to reach a valuation in access of USD 2,000 Mn exhibiting a healthy growth rate till the end of the forecast period. PSiP is used in automotive systems, portable devices, telecom devices, servers, routers, set-top boxes, laptops, desktop systems, and medical devices.

The consumer electronics segment currently accounts for the lion’s share of the market.  The application is expected to reach a valuation of USD 1,354.4 Mn by 2023. The consumer electronics segment has been witnessing a robust growth in recent years, consequently driving the demand for PSiPs and PwrSoC.  

Regional Analysis

Regions that were covered in the report include Europe, North America, Asia Pacific (APAC), the Middle East Africa (MEA), and South America. The market in APAC is expected to remain highly attractive during the forecast period. In 2017, APAC commanded 48.3% share of the market and projected to exhibit 26.9% CAGR during the assessment period. The manufacturing sector in the region has undergone massive transformation in recent years, which is having a positive impact on the market in the region. China’s rise as a global manufacturing hub has drawn significant investment in the countries.

North America and Europe are the two other important markets for PSiP and PwrSoC. During the review period, the market in North America is projected to post a relatively higher CAGR, meanwhile Europe will retain its position as the third largest power supply in package (PSiP) and power supply on chip (PwrSoC) market.

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