Thermal Interface Materials Market Research Outlook and Opportunities 2022-2027

Thermal Interface Materials Market

Thermal interface materials (TIM) are materials inserted between two components to increase the thermal heat between them. The global thermal interface materials market report by Market Research Future (MRFR) looks at the impact of product miniaturization and the production of various consumer electronic products. In addition, it highlights drivers, restraints, trends, and opportunities for the period of 2022 to 2030 (forecast period).

Competition Outlook

Indium Corporation, Parker Chomerics, Momentive Performance Materials Inc., Zalman Tech Co., Ltd., Bergquist Company, Henkel Corporation, 3M Company, Laird Technologies, Dow Corning, and others are key players of the global thermal interface materials market. Players are creating manufacturing units to add value to the supply chain and lowering production costs.

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Market Scope

The global thermal interface materials market is expected to reach a significant valuation by exhibiting a CAGR of 10% during the forecast period. It is driven by the need for faster computing and execution of tasks. Awareness of efficient lighting systems and saving of power bills has led to the adoption of LED lights over conventional lights. The thermal interface materials act as a medium for controlling the heat within the device to prevent overload on the main system.

Product miniaturization due to the breakthroughs in integrated circuit designs and faster speeds of processors will work in favor of the market. The increasing demand for thermal greases and die in light of massive demand for power will drive the need for these materials. They can control power leakage and improve the performance of the devices. For instance, Shin-Etsu’s thermal materials ensure thermal conductivity while ensuring the separation of electrical components.

Rise of consumer electronic products owing to the proliferation of the Internet is likely to induce heavy demand for thermal interface materials. Technologies such as artificial intelligence, machine learning, and construction of large data servers as well as the continuous production to keep up with the growing demand of electronic devices will bode well for the market.

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Segmentation

The global thermal interface materials market is segmented by type and application.

By type, it is segmented into elastomeric pads, metal based, gap fillers, greasers adhesives, and others.

By application, it is segmented into industrial machinery, telecommunications, automotive, computer, and others. The telecommunications segment is touted to be beneficial to the TIM market owing to the demand for connectivity across devices and procurement of consumer electronic devices. This is primarily influenced by the massive sales of smartphones.

Regional Analysis

Based on regions, the global Thermal Interface Materials Market Research is segmented into North America, Europe, Asia Pacific (APAC), and Rest-of-the-World (RoW).

North America is touted to dominate the market owing to the growth in information technology (IT) and telecommunications industries. Development for carbon nanotubes due to electrical and thermal conductivity will bode well for the global thermal interface materials market. Furthermore, inclination towards electric and hybrid vehicles as well as rapid industrialization will accelerate its demand. The high internet bandwidth required for data speeds will also act as a catalyst for market growth.

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Industry News

Fujipoly has introduced a new TIM, Sarcon PG45A, for use in electronic components with high rates of material compression. The thermal gap filler will act as a medium between the heat source and the sink.

Table of Content

1 Executive Summary

2 Research Methodology

2.1 Scope of The Study

2.1.1 Definition

2.1.2 Research Objective

2.1.3 Assumptions

2.1.4 Limitations

2.2 Research Process

2.2.1 Primary Research

2.2.2 Secondary Research

2.3 Market Size Estimation